Evaporation, Sputtering and Plating

Metal deposition is done either by our Temescal E-Beam Evaporator, or by our TFE Sputtering System. Available metals include: Au, Pt, Ti, Ni, Ag, Cr, Ge, Al. Thick gold plating is done in our wafer electroplating station. We perform silicon oxide, silicon nitride and oxynitride deposition by PECVD.