FAB Services Lap, Polish, Cleave and Dice

Lap, Polish, Cleave and Dice


We can thin the wafer down to ~50 microns by grinding and polishing, or we can remove the substrate. Thinned wafers are typically diced and delivered to the customer on stretched tape.

Equipments:
  • G & N Grinder
  • Dynatex Scriber

OEpic's LPCD
 


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