Packaging and Reliability
OEpic offers limited packaging for device evaluation and reliability tests.
Devices can be diced, die-attached, and wire bonded on standard or custom packages.
Special packaging for high speed evaluation is also available.
- Die attaching
- Wedge bonding
- Ball bonding
- Ribbon Bonding
Limited reliability tests are also available:
- Device burn-in
- Active burn-in (insert atmosphere)
- Damp heat