FAB Services Packaging and Reliability

Packaging and Reliability

OEpic offers limited packaging for device evaluation and reliability tests. Devices can be diced, die-attached, and wire bonded on standard or custom packages. Special packaging for high speed evaluation is also available.

  • Dicing
  • Die attaching
  • Wedge bonding
  • Ball bonding
  • Ribbon Bonding

Limited reliability tests are also available:
  • Device burn-in
  • Active burn-in (insert atmosphere)
  • Damp heat
OEpic's Package and Reliability

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