FAB Services Dry and Wet Etching

Dry and Wet Etching


We offer Reactive Ion Etching (RIE), Inductively Coupled Plasma (ICP) mode, and wet etching. .

Features:
  • Process Gases Available: SF6, Cl2, CF4, BCl3, O2, Ar, He, N2
  • Wafer Clamping and liquid nitrogen backside cooling
  • 4" wafer capable.
  • Temperature controlled chamber
  • 2KW ICP, 600W RIE
OEpic's Dry and Wet Etching
 


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